Introduction to the application of four common sputtering targets

Sputtering target material variety, high purity requirements, and the application industry is also very wide, today we talk about the four commonly used in the four fields of sputtering target, high purity aluminum target, titanium target, tantalum target, tungsten titanium target. They cover areas such as flat-panel displays, semiconductors, storage and solar cells.

Aluminum target (stock purity 99.99%-99.999%)

High purity aluminum and its alloys are widely used as conductive thin films. In their field of application, the manufacture of VLSI chips requires a very high purity of sputtering target metal, usually up to 99.9995%, while flat-panel displays and solar cells have slightly lower metal purity.

Titanium target (stock purity 99.99%-99.999%)

Titanium is one of the commonly used barrier film materials (corresponding conductive layer material is aluminum) in VLSI chips. The titanium target will be used in conjunction with the titanium rings during the pre-chip manufacturing process. The main function is to assist the sputtering process of titanium target material, which is mainly used in the field of ultra large scale integrated circuit chip manufacturing.

Tantalum target (stock purity 99%, 99.5%, 99.9%, 99.995%, 99.99%, 99.995%99.999%)

With the explosive growth in demand for consumer electronics such as smartphones and tablets, the demand for high-end chips has soared, making tantalum a hot mineral resource. However, the scarcity of tantalum resources makes the high purity tantalum target material expensive, which is mainly used in large-scale integrated circuits and other fields.

Titanium-tungsten target material (stock purity 99.95%)

Tungsten titanium alloy has low electron mobility, stable thermo-mechanical properties, good corrosion resistance and good chemical stability. In recent years, tungsten-titanium alloy sputtering targets have been used as contact layer materials for gate circuits in semiconductor chips. In addition, tungsten and titanium targets can also be used as barriers in the metal connections of semiconductor devices. For high temperature environment, mainly used in vlsI and solar cells.