Molybdenum sputtering targets for semiconductors

Today, sputtering targets have a wide range of applications, from the semiconductor industry to the film deposition of various materials in integrated circuit processing. Sputtering is a well-established technique for depositing thin films of a variety of materials onto substrates of a variety of shapes and sizes. In order to obtain the desired properties in the sputtering deposited film, the manufacturing materials and processes used to manufacture the sputtering target are crucial. Below we will look at molybdenum sputtering targets for semiconductors.

Semiconductors are used for molybdenum sputtering targets

Materials used for semiconductors include tungsten, molybdenum, niobium, titanium, silicon and other pure metal targets, as well as tungsten, molybdenum, titanium, silicon, tantalum and other alloy targets, as well as oxides or nitrous compounds. The process of determining the material is just as important as the parameters of the deposition operation perfected by engineers and scientists during the coating process.

Compared with other deposition methods, sputtered films have better adhesion on the substrate, and materials with very high melting point such as molybdenum and tungsten are also easy to sputter. In addition, sputtering can be done from top to bottom, while evaporation can only be done from bottom to top.

Sputtering targets are usually round or rectangular, but other shapes can be made, including square and triangular designs. A substrate is an object to be coated, which can include semiconductor wafers, solar cells, optical components, or many other possibilities. The thickness of the coating is usually in the angstrom to micron range. The film can be a single material or multiple materials in a multilayer structure.

Molybdenum, as a kind of refractory metal, has excellent mechanical properties, low expansion, high thermal conductivity and very high electrical conductivity at high temperature. As a sputtering target, there are many combinations, such as pure molybdenum target, molybdenum titanium target, molybdenum tantalum target, molybdenum alloy target (such as TZM plate).

Molybdenum sputtering target material has the characteristics of high purity, high density, fine and even grain, so that high sputtering efficiency, uniform film thickness and smooth etched surface can be obtained during sputtering.