Tungsten, molybdenum, tantalum, niobium, titanium and nickel targets

Classification of titanium, tungsten, molybdenum, tantalum, niobium, Zirconium and nickel targets

Sputtering target material is mainly used in the electronics and information industry, such as integrated circuit, information storage, liquid crystal display, laser memory, electronic control devices, etc., can also be used in the field of glass coating, also can be used in wear-resistant materials, high temperature corrosion resistance, high-grade decorative supplies and other industries.

classification

• According to the shape can be divided into long target, square target, round target, heterogeneous target

• According to the composition can be divided into metal target, alloy target, ceramic compound target

• According to different applications, it can be divided into semiconductor associated ceramic targets, recording medium ceramic targets, display ceramic targets, superconducting ceramic targets and giant magnetoresistance ceramic targets, etc

• According to the application field, it can be divided into micro-electronic targets, magnetic recording targets, optical disk targets, precious metal targets, thin film resistance targets, conductive film targets, surface modified targets, light coating targets, decorative layer targets, electrode targets, packaging targets, other targets

Principle of magnetron sputtering:

An orthogonal magnetic field and electric field are added between the target pole (cathode) and anode by sputtering, and the required inert gas (usually Ar gas) is filled into the high vacuum chamber. The permanent magnet forms a magnetic field of 250 ~ 350 gauss on the surface of the target material, which is orthogonal with the high voltage electric field. Under the action of electric field, the gas based on AR technology is ionized into positive ions and electrons, and a certain negative high pressure is added to the target. Under the action of magnetic field, the electrons emitted from the target pole have an increased chance of ionization with the working gas, forming a high-density plasma near the cathode. The ions based on AR technology accelerate to fly to the target surface at a very high speed under the action of Lorentz force When the target surface is bombarded with the degree, the sputtered atoms on the target fly away from the target surface to the substrate deposition film with high kinetic energy following the momentum conversion principle. Magnetron sputtering is generally divided into two types: tributary sputtering and RF sputtering. The principle of tributary sputtering equipment is simple, and its speed is fast when sputtering metal. Radio-frequency sputtering is used more widely. In addition to conductive materials, non-conductive materials can also be sputtered. At the same time, reactive sputtering is also used to prepare compounds such as oxides, nitride and carbide. If the frequency of radio frequency is increased, it becomes microwave plasma sputtering, commonly used electron cyclotron resonance (ECR) microwave plasma sputtering.

Magnetron sputtering coating target material:

Metal sputtering coating target, alloy sputtering coating target, ceramic sputtering coating target, boride ceramic sputtering target, carbide ceramic sputtering target, fluoride ceramic sputtering target, nitride ceramic sputtering target, oxide ceramic target, selenide ceramic sputtering target, siliciide ceramic sputtering target, sulfide ceramic sputtering target, telluride ceramic sputtering target, other ceramic targets Materials, chromium-doped silicon monoxide ceramic target (Cr-SiO), indium phosphide target (input), lead arsenide target (pba), indium arsenide target (ina).

High purity and high density sputtering targets include:

Sputtering target material (purity :99.9% - -99.999%)

1. Metal target material:

Nickel target, nickel, titanium target, titanium, zinc target, zinc, chromium target, Cr target, magnesium target,Mg, niobium target,Nb target, tin target, tin, aluminium target, Al, Indium target, in iron target, iron, zirconium aluminium target,ZrAl, titanium aluminium target, titanium, zirconium target, zirconium aluminium target, silicon aluminium alloy, silicon target,Si, copper target Copper, tantalum target T, germanium target, General Electric, silver target,Ag), cobalt target, gold target Au, Gadolinium target,Gd target, lanthanum target, Los Angeles, yttrium target,Y, cerium target,Ce, tungsten target,w, stainless steel target,NiCr, hafnium target, high frequency, molybdenum target, molybdenum, iron and nickel target, Finney, tungsten target,w and other metal sputtering targets.

2. Ceramic target material

ITO target, azo target, magnesium oxide target, iron oxide target, silicon nitride target, silicon carbide target, titanium nitride target, chromium oxide target, zinc oxide target, zinc sulfide target, silicon dioxide target, silicon monoxide target, cerium oxide target, zirconium dioxide target, niobium pentoxide target, titanium dioxide target, zirconium dioxide target, hafnium dioxide target, titanium diboride target, zirconium diboride target, tungsten oxide target, trioxide target Aluminum target tantalum pentoxide, niobium pentoxide, magnesium fluoride target, yttrium fluoride target, zinc selenide target, aluminum nitride target, silicon nitride target, boron nitride target, titanium nitride target, silicon carbide target, lithium niobate target, praseodymium titanate target, barium titanate target, lanthanum titanate target, nickel oxide target and other ceramic sputtering targets.

3. Alloy target material

Ni-cr alloy target, Ni-Vanadium alloy target, Al-Si alloy target, Ni-Cu alloy target, Ti-Al alloy, Ni-vanadium alloy target, Fe-boron alloy target, Fe-silicon alloy target and other high purity alloy sputtering targets.

Peripheral vascular disease (physical vapor deposition) refers to the process by which physical processes are used to achieve material transfer, transferring atoms or molecules from a source to a substrate surface. Its role is to have some special properties (high strength, wear resistance, heat dissipation, corrosion resistance, etc.) of the particle spray on the lower performance of the parent, so that the parent has better performance! PVD basic methods: vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive ion plating, RF ion plating, DC discharge ion plating)